Vapor-phase Vacuum Reflow
Sensormate owns ASSCON VP6000 Vacuum to implement vapor-phase soldering in vacuum. Typical applications are HTCC lid hermetic sealing, eutectic chip bonding, thermal intense board population and 3D assembly.
In the process zone of the VP6000, the assembly is pre-heated and soldered under inert conditions. After completing the soldering process the vacuum module seals the assembly from its environment and the air is pumped out. The negative pressure removes voids and entrapments between solder joints which is still in liquid state resulting in void-free soldering.
This technology is particularly advantageous when the solder joints are to dissipate heat and large area, since air inclusions increase the thermal resistance of the solder joint. In addition, voids will deteriorate the mechanical load-bearing capacity or become progressively worse in vacuum package of uncooled IR image sensors.